GREENVILLE, S.C., Nov. 16 – KEMET Corporation, a leading manufacturer of tantalum, ceramic, aluminum, film, paper and electrolytic capacitors, today announced that it is featuring its electrolytic snap-in and screw terminal capacitors this week at Electronica 2012 in Munich, Germany.
"With the recent integration of the KEMET Foil Manufacturing plant in Tennessee and development of the new automated production facilities in Portugal, KEMET is now, more than ever, able to offer high quality snap-in and screw terminal electrolytic capacitors at competitive prices and lead times," stated Werner Lohwasser, KEMET Vice President of Electrolytic and Filter Business Unit.
KEMET electrolytic capacitors afford design engineers some of the widest choices of electrolytic capacitors to suit every application in power electronics equipment. KEMET's technology is developed by its research and development teams, who are constantly evaluating new materials and processes as well as designing new electrolytes to exceed market requirements.
Some of the recent advances in technology on display at Electronica 2012 include low inductance screw terminal capacitors, which have a typical inductance of 12 nH or less; 400 V low ESR electrolyte, which reduces the typical ESR by 30%; high vibration screw terminal capacitors up to 90 mm in diameter, which can withstand 20 G's of force; and high temperature screw terminal devices up to 200 V and 125°C operating temperature.
For more information on KEMET electrolytic capacitors, please visit our booth at Electronica 2012 in Hall B6, Booth 442 at the New Munich Trade Fair Centre.
KEMET's common stock is listed on the NYSE under the symbol "KEM." At the Investor Relations section of our web site at http://ir.kemet.com/, users may subscribe to KEMET news releases and find additional information about our Company. KEMET applies world class service and quality to deliver industry leading, high performance capacitance solutions to its customers around the world and offers the world's most complete line of surface mount and through-hole capacitor technologies across tantalum, ceramic, film, aluminum, electrolytic, and paper dielectrics.